Will micro-fluidics solve thermal issues with 3D-ICs ?

The promise of monolithic 3d integrated circuits, with multiple die layers connected through monolithic vias, has been held back in part by their thermal characteristics. This research from Ecole Polytechnique Federale de Lausanne may offer a solution by combining microfluidics and electronics within the same die layer to produce a monolithically integrated cooling structure.

#3dChips #integratedcircuits #coolingtechnology

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